Broadcom BCM88920 StrataDNX™ Ramon3 51.2Tb/s Fabric Element BGA Exploratory Packaging Report
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The Broadcom BCM88920 StrataDNX™ Ramon3 is telecommunications industry switch gear packaged in a flip-chip ball grid array (FC-BGA) style package. It has a large footprint with over 9,000 package connections and a very low die-to-package ratio. This report presents detailed delayering of the organic substrate supporting the chip, as well as die photographs and analysis.
