Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

The IAM blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years. TechInsights' Martin Bijman adds to the story with some competitive landscape analysis.

It has been a year since Microsoft released the Azure IP Advantage program – a service that "provides the industry’s most comprehensive protection against intellectual property (IP) risks" by making 10,000 of their global patents available to Azure clients.

What’s inside one of the most anticipated phones of the summer? See TechInsights’ Samsung Galaxy Note9 teardown blog to learn who won what sockets.

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

TechInsights' analyst Jeongdong Choe will be presenting at this year's Flash Memory Summit on 3D NAND Flash Cell Architecture: Recent Progress and Comparisons.

Japan remains Asia’s IP powerhouse and IAM is pleased to announce that our bi-annual IPBC dedicated to this influential jurisdiction will return to the Hotel Okura Tokyo on September 13 2018.

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

TechInsights is happy to report that we have found and analyzed Anti-fuse array blocks on a Samsung 18 nm DDR4 DRAM die.

We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

Learn more about what reports we have available and planned for this part.

Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS "Motion Eye" camera offering with 960 fps video and predictive capture.

The Qualcomm RF360 Chipset includes the WTR5975 Gigabit LTE Transceiver, QET4100 Envelope Tracker and the Snapdragon X16 LTE MDM9250 Modem.

The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.

This report is a circuit analysis of the Intel PMB5750 LTE Tranceiver. Apple’s use of the Intel modem chipset is a huge event in the industry as Intel modems will represent a minority of iPhone shipments (est. 22 M units in 2016 and 23 M units in 2017).