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For over 25 years TechInsights has been a trusted patent and technology partner to the world’s largest and most successful companies including 37 of the top 50 U.S. patent holders. By revealing the innovation others can’t inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions.

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Apple Watch Series 3 Teardown

We have completed the Apple Watch Series 3 teardown. We were especially interested in its cellular functionality, and whether the LTE chipset supplier is Qualcomm or Intel. Our findings are presented in the following paragraphs.

Technology Blog
Apple iPhone 8 Plus Teardown

By now, even if you didn’t watch Apple’s announcement event, you’ve probably heard the news: along with a few other new products, Apple will be releasing the Series 3 Watch, the iPhone 8 and 8 Plus later this month, and the iPhone X in early November.

Technology Blog
10 Years of iPhone Hardware

TechInsights' is compiling a retrospective into some of the hardware choices Apple has made for iPhone through the years.

Technology Blog
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Patent Intelligence Blog
Growth by Acquisition: Qualcomm in Talks to Acquire NXP

Read on for an analysis of what this acquisition means to the patent portfolio of Qualcomm.

Patent Intelligence Blog
Who will acquire Intersil?

Speculation about who will acquire analog semiconductor manufacturer Intersil is high in the latest chapter of the 2016 Mergers and Acquisitions story.

Patent Intelligence Blog
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Apple Watch Series 3 Teardown

We have completed the Apple Watch Series 3 teardown. We were especially interested in its cellular functionality, and whether the LTE chipset supplier is Qualcomm or Intel. Our findings are presented in the following paragraphs.

Technology Blog
Apple iPhone 8 Plus Teardown

By now, even if you didn’t watch Apple’s announcement event, you’ve probably heard the news: along with a few other new products, Apple will be releasing the Series 3 Watch, the iPhone 8 and 8 Plus later this month, and the iPhone X in early November.

Technology Blog
10 Years of iPhone Hardware

TechInsights' is compiling a retrospective into some of the hardware choices Apple has made for iPhone through the years.

Technology Blog
TSMC 10 nm Process

TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

Latest Reports
Intel 3D XPoint

3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.

Latest Reports
Samsung 10 nm LPE Process

The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process...

Latest Reports
iPhone 8 Teardown: Faster Intel Modem And Pricey Memory Chips

The new iPhone 8 is a lot like the iPhone 7 both outside and in, but it's costing Apple a bit more to make.

Latest News
iPhone 8 Still Packs Q’Comm, NXP

Teardown is good news for B’com, Skyworks

Latest News
Ten Years of the iPhone And Counting…

With the introduction of the iPhone 8 upon us, TechInsights’ Dick James takes a look back at the phone’s evolution, breaking down and comparing components and costs from the original to the iPhone 7.

Latest News
IPBC Asia, Tokyo, Japan

The Asia-Pacific region is cementing its position as the focus point for the international IP market as its rapid development drives deal making, IP investment and litigation trends. Against this background, IAM is pleased to be returning to Tokyo for the fifth IPBC Asia, hosted at the Palace Hotel on October 29 to 31 2017.

Latest Events
IP Dealmakers, New York, NY

In just a few short years, the IP Dealmakers Forum has become the definitive gathering of complex IP monetization experts and public and private market investors, and the must-attend event of the year. Capped at 200 pre-approved attendees, the forum attracts an elite set of IP market participants from across the globe.

Latest Events
IEDM 2017, San Francisco, CA

With a history stretching back more than 60 years, the IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology.

Latest Events
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
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Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
Memory/Selector Elements for Intel OptaneTM XPoint Memory
TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory.
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Technology Blog
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
View Post
Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has caught the attention of many producers of memory products.
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A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
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Technology Blog