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For over 25 years TechInsights has been a trusted patent and technology partner to the world’s largest and most successful companies including 37 of the top 50 U.S. patent holders. By revealing the innovation others can’t inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions.

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  • Samsung 64L 3D V-NAND

    Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

    Latest Reports
    Toshiba 64L NAND – BiCS FLASH

    Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.

    Latest Reports
    Most interesting technology developments and IP issues of 2017

    We asked our team what they thought were the most interesting developments in their respective fields in 2017.

    Technology / IP Blog
  • Image Sensor Technology: Noteworthy Developments in 2017

    We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

    Technology Blog
    Samsung 18 nm DRAM Analysis

    TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

    Latest Reports
    Apple iPhone X Teardown

    The phone is in and our preliminary findings have been published. Follow our blog for updates as we continue to examine this phone.

    Technology Blog
  • Cost Comparison – Apple iPhone X, Apple iPhone 8, Huawei Mate 10, Samsung Galaxy S8

    Apple, Huawei and Samsung – TechInsights has conducted an in-depth analysis of each provider’s most recent contenders.

    Technology Blog
    Intel/Micron 64L 3D NAND Analysis

    The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

    Latest Reports
    Cost Comparison – Huawei Mate 10, iPhone 8, Samsung Galaxy S8

    While Apple and Samsung have been engaged in a tug-of-war for the title of top-selling smartphone provider over the past couple of years, China’s dominant OEM - Huawei - has been quietly gaining traction globally with their P- and Mate-series offerings.

    Technology Blog
Most interesting technology developments and IP issues of 2017

We asked our team what they thought were the most interesting developments in their respective fields in 2017.

Technology / IP Blog
Samsung Read Retry for 3D NAND

Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others.

Patent Intelligence Blog
Patent Intelligence Blog
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Most interesting technology developments and IP issues of 2017

We asked our team what they thought were the most interesting developments in their respective fields in 2017.

Technology / IP Blog
Intel/Micron 64L 3D NAND Analysis

The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

Latest Reports
Image Sensor Technology: Noteworthy Developments in 2017

We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

Technology Blog
    Filter technology posts by:
  • Samsung 64L 3D V-NAND

    Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

    Latest Reports
    Toshiba 64L NAND – BiCS FLASH

    Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.

    Latest Reports
    Samsung 18 nm DRAM Analysis

    TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

    Latest Reports
  • Intel/Micron 64L 3D NAND Analysis

    The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

    Latest Reports
    TSMC 10 nm Process

    TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

    Latest Reports
    Intel 3D XPoint

    3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.

    Latest Reports
EDTM 2018, Kobe, Japan

The 2nd Electron Devices Technology and Manufacturing (EDTM) Conference 2018 is a full four-day conference to be held in Kobe, Japan from March 13th to 16th, 2018.

Latest Events
IPBC Europe, Amsterdam, Netherlands

Taking place in Amsterdam in March 2018, the event will provide IP owners in Europe with tools and insights that will enable them to craft world-class IP management and value creation programmes.

Latest Events
IPBC Korea, Seoul, Korea

IPBC Korea will be a one-day event held at the JW Marriot Dongdaemun, Seoul on April 26 2018.

Latest Events
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Intel/Micron 64L 3D NAND Analysis

The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

Latest Reports
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
1Memory/Selector Elements for Intel OptaneTM XPoint Memory
TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory.
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Technology Blog
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
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Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
View Post
Technology Blog
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has caught the attention of many producers of memory products.
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Technology Blog
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Image Sensor Technology: Noteworthy Developments in 2017

We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
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Technology Blog
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Samsung 64L 3D V-NAND

Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

Latest Reports
Toshiba 64L NAND – BiCS FLASH

Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.

Latest Reports
Samsung 18 nm DRAM Analysis

TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

Latest Reports
    Filter technology posts by:
Samsung 18 nm DRAM Analysis

TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

Latest Reports
TSMC 10 nm Process

TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

Latest Reports
Samsung 10 nm LPE Process
The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process.
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Latest Reports
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Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor

Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS "Motion Eye" camera offering with 960 fps video and predictive capture.

Latest Reports
Image Sensor Technology: Noteworthy Developments in 2017

We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

Technology Blog
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Qualcomm Latest RF360 Chipset

The Qualcomm RF360 Chipset includes the WTR5975 Gigabit LTE Transceiver, QET4100 Envelope Tracker and the Snapdragon X16 LTE MDM9250 Modem.

Latest Reports
Apple W1 343S00131 Bluetooth Module

The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.

Latest Reports
Intel PMB5750 LTE Tranceiver Circuit Analysis

This report is a circuit analysis of the Intel PMB5750 LTE Tranceiver. Apple’s use of the Intel modem chipset is a huge event in the industry as Intel modems will represent a minority of iPhone shipments (est. 22 M units in 2016 and 23 M units in 2017).

Latest Reports