Effective January 1, 2017, Chipworks merged with TechInsights to create the World’s premiere company for revealing the innovation others can’t inside advanced technology. With almost half-a-century of combined experience, and specialized products and services, the new TechInsights enables business leaders to make the best, fact-based IP and technology investment decisions.

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A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
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Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
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Patent Intelligence Blog
Growth by Acquisition: Qualcomm in Talks to Acquire NXP

Read on for an analysis of what this acquisition means to the patent portfolio of Qualcomm.

Patent Intelligence Blog
Who will acquire Intersil?

Speculation about who will acquire analog semiconductor manufacturer Intersil is high in the latest chapter of the 2016 Mergers and Acquisitions story.

Patent Intelligence Blog
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A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
View Post
Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
View Post
Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
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Technology Blog
Intel 3D XPoint

3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.

Latest Reports
Samsung 10 nm LPE Process

The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process...

Latest Reports
Qualcomm WTR5975 Gigabit LTE Transceiver

The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support.

Latest Reports
TechInsights Finds Microsoft Azure IP Advantage Portfolio Ranks First in Cloud Innovation

Analysis Finds the Microsoft Azure IP Advantage outranks IBM, Oracle, Google, Amazon, and VMware’s Cloud portfolios, indicating a solid footing in Cloud innovation.

Latest News
What TechInsights analysts are watching in 2017

TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging.

Latest News
More Enlightenment on Optane

Digging deeper into a transmission electron microscope image of Intel's Optane by TechInsights...

Latest News
IPBC Global, Ottawa, Canada

TechInsights is proud to be the Country Sponsor of IPBC Global 2017. In addition to sponsoring, we will be moderating the following sessions:

Boot camp: The Internet of Things
A deep dive into the IoT patent landscape. Moderated by Ian MacLean, Sr VP, IP Services, TechInsights

Meeting the convergence challenge
Technological developments mean significant challenges for senior corporate IP leaders. Moderated by Mike McLean, Sr VP, IP Services, TechInsights

Latest Events
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Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
Memory/Selector Elements for Intel OptaneTM XPoint Memory
TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory.
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Technology Blog
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has caught the attention of many producers of memory products.
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Technology Blog
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Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
View Post
Technology Blog
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has caught the attention of many producers of memory products.
View Post
Technology Blog
Qualcomm Snapdragon 835 First to 10 nm
With the first set of Samsung Galaxy S8 teardowns, we have access now to the first SoCs produced on "10 nm" class technology.
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SoC DA Blog
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A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
View Post
Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
View Post
Technology Blog
Sony Launches First Three-Layer, 960 fps Camera with Sandwich-Stacked DRAM
During the ISSCC conference last Februry, sony issued a press release describing the "Industry's First 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones...
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Technology Blog