Latest Blogs and Commentary
Deep Dive Teardown of the Magna Electronics ADAS GP009379212 Automotive
Launched in 2023 by the USA vehicle company Fisker, the mid-size electric crossover SUV. The Fisker Ocean is equipped with an array of advanced driver assistance systems (ADAS). Utilizing computer vision, radar, and diverse sensors, these ADAS features enhance safety and comfort for the driver.
Deep Dive Teardown of the Apollo Zhilian Cockpit Domain Controller CDC? Automotive
Several manufacturers share the design wins for Apollo Zhilian for Jidu Robo-01 Cockpit Domain Controller. The main processor came from Qualcomm® Snapdragon Automotive generation. The Qualcomm SA8295P is a high-end processor, made with 5 nm FinFET process, featuring an octa-core CPU. Renesas supplied the 32-Bit Microcontroller from RH850 family created among others for automotive electronics.
James Sanders
James Sanders Senior Analyst James Sanders is a Senior Analyst at TechInsights with over 5 years of experience as an industry analyst, and 7 years of experience as a technology journalist. James has a passion for researching the innovations being
Survey Plus Teardown of the Honor Magic 6 BVL-AN00 Smartphone
The Honor Magic 6 comes with a 6.78-inch OLED touchscreen display offering a resolution of 2800 × 1264. The display has a frequency of 120 Hz. The phone is powered by a Qualcomm SM8650-002-AB Applications/Baseband Processor.
Survey Plus Teardown of the Vivo S18 5G V2323A Smartphone
The Vivo S18 is equipped with the Qualcomm Snapdragon 7 Gen3 processor. This phone is powered by a 5000 mAh battery with support for 80 W fast charging. The SIM card tray can accommodate two nano-SIM cards.
Deep Dive Teardown of the ecobee Smart Thermostat ECB601 Home Thermostat
The ecobee Smart Thermostat ECB601 is designed to control home heating and cooling systems directly from the phone app or voice commands with Siri or Alexa to create heating and cooling schedules as well as view energy usage reports.
Analysis: Global 5G and LTE Handset Revenue and ASP by Vendor – Q4 2023
Global 5G handset industry revenues and shipments grew double digits in Q4 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing behind Apple. Samsung is the world’s second-largest 5G vendor in terms of shipments and revenues.
Autonomous Vehicle Carmaker Announcements
This database covers all the major carmaker announcements in regards to autonomous vehicles, for both semi- and fully autonomous technologies. Comments are embedded in the "Release Date" column to give further details, e.g., "End of 2024". In this update, TechInsights has included announcements and releases of different ADAS and automated driving platforms by SAE Levels of automation from automakers and Tier 1 developers worldwide.
Apple Vision Pro Teardown
Discover the inner workings of the Apple Vision Pro A2117 with our in-depth teardown analysis. Explore its M2 processor, Micro-OLED display, sensor suite, connectivity options, and spatial audio technology.
The Chip Insider® – Taiwan’s Earthquake: Follow-up
Follow-up to the 5 April Chip Insider on the Hualien City earthquake. As predicted in this write-up, so far the earthquake has had no measurable impact. TSMC proved it definitively this time as their people polished the company’s reputation for being the “trusted capacity provider”.
Auto IC Sales growth muted YoY the week ending April 19, 2024
Semiconductor sales increased 1% last week and were up 23% from this time last year. Zooming in on Auto IC, the 13-week MA was flat YoY last week. TechInsights forecasts Auto IC sales will modestly increase 3% to $44 billion in 2024.
S32N Processors Consolidate ECUs
NXP’s new S32N55, part of a new S32N processor family and the newly announced CoreRide brand, centralizes core driving functions that are currently implemented in localized ECUs.
Deep Dive Teardown of the Caterpillar S75 BM1S1B Smartphone
The Main Cover is a Co-Molded Reinforced Plastic Frame. It consists of a Glass-Filled Plastic Inner Frame and Soft Plastic Outer Frame. Waterproof elements available in the construction of devices for: Sealed Buttons Port with rubber membrane, Sealing Tape around the Main Enclosures, Silicone Gasket on Sim Tray Cover, and Sealing Tape around Cameras Windows and Camera Window's Positioning Handle.
Deep Dive Teardown of the ecobee Smart Doorbell EB-CAMSDB-01 Doorbell Camera
The Ecobee Smart Doorbell Camera is a smart home security system unit equipped with a 175-degree vertical view camera. It can stream a live view to Ecobee Smart Thermostat through low energy communication system of BT 5.0 and 2.4/5 GHz WiFi.
Forecast: Global 5G Smartphone Wholesale ASP & Revenue by Technology to 2029
Global 5G smartphone wholesale revenues will surge between 2019 and 2029. 5G is by far the fastest-growing sector of the smartphone industry for the next decade. The majority of mmWave sales volumes will come from the North American market. Sub-6GHz will remain the main 5G technology for the foreseeable future.
SK hynix Hi-5021Q 50MP 0.70μm Pixel CMOS Image Sensor Device Essentials Plus
The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.
Deep Dive Teardown of the Xiaomi Redimi K70 Pro 23117RK66C Smartphone
Both smartphones also have the same battery charging design with the only exception that Xiaomi 14 Pro has Wireless charging capabilities. It is also similar to the Xiaomi Redmi Note 13 Pro’s design with a difference in which main SoC (SC8551A) was used.
Deep Dive Teardown of the Fitbit Charge 6 G3MP5 Activity Tracker
The Fitbit Charge 6 G3MP5 is the latest activity tracker from Fitbit Inc. and an improved successor to the Fitbit Charge 5 FB421. The Charge 6 has a 1.04” OLED Display. In both devices, the Display/Touchscreen Subsystem is made by Truly Opto-electronics and has the same part number. The Display Panel and touchscreen Module are separated in this subsystem.
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