Interested in this report?

Published: 9 September 2015

This Circuit Vision analysis covers circuit extraction, analysis and organization of all major circuit blocks on the Samsung K3RG3G30MM 3 Gbit LPDDR4 Mobile DRAM die. The analysis includes deliverables such as: Architectural Overview • Package Photographs (Top and Bottom) • Package X-Ray • Die Photograph • Die Map (Physical location of circuit elements) • Array Information • Dimensions Address Bitmap Data Access Diagram Functional Block Diagram Data Path • Hierarchical block diagram of data path • Input Path Schematics (Complete circuits from pad to memory cell) • Input Buffers • Write Drivers (Local and Global) • Data precharge and switching • Output path Schematics (Complete circuits from memory cell to pad) • Sense Amplifiers o Data Amplifiers • Data precharge and switching • Output Buffers • Multibit test comparison • Data mask Address Path • Hierarchical block diagram of address path • Address buffers • Row and column address latches (including latency configuration if applicable) • Block and wordline decoding • Bitline decoding • Redundancy scheme for row and column Voltage Generator System • VPP Pump and Regulator • VBB Pump and Regulator • Internal VDD Regulator • Internal Reference Voltage Generators Voltage Switches • Bitline Precharge Voltage Generator • Cell Plate Voltage Generator Command, Control and Test Circuitry • Input Buffers for all command and clock pins • Command decoding and control signal generation • Mode registers Refresh counters and control Power Up Circuitry Embedded Flash Memory • Test circuitry

Recent OMR Reports

Buy Now  |   Price: $9,000.00 (USD)   |   Report  |  DEF-1705-803  |   Published: 21 July 2017
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders:...
Buy Now  |   Price: $19,500.00 (USD)   |   Report  |  ACE-1704-803  |   Published: 20 July 2017
This deliverable is Part 2 of the Advanced CMOS Essentials Project on the Samsung 10LPE FinFET process found in the Qualcomm MSM8998 Snapdragon 835 application processor. The Advanced CMOS Essentials...
Buy Now  |   Price: $30,000.00 (USD)   |   Report  |  IPR-1704-801  |   Published: 17 July 2017
This report presents an Imager Process Review of the Sony IMX400 19 MP, 1.22 µm pixel pitch, triple-stacked BI CIS extracted from a Sony Xperia XZs (model G8232) smartphone. The IMX400 is Sony's fourth...