Interested in this report?

Published: 9 September 2015

This Circuit Vision analysis covers circuit extraction, analysis and organization of all major circuit blocks on the Samsung K3RG3G30MM 3 Gbit LPDDR4 Mobile DRAM die. The analysis includes deliverables such as: Architectural Overview • Package Photographs (Top and Bottom) • Package X-Ray • Die Photograph • Die Map (Physical location of circuit elements) • Array Information • Dimensions Address Bitmap Data Access Diagram Functional Block Diagram Data Path • Hierarchical block diagram of data path • Input Path Schematics (Complete circuits from pad to memory cell) • Input Buffers • Write Drivers (Local and Global) • Data precharge and switching • Output path Schematics (Complete circuits from memory cell to pad) • Sense Amplifiers o Data Amplifiers • Data precharge and switching • Output Buffers • Multibit test comparison • Data mask Address Path • Hierarchical block diagram of address path • Address buffers • Row and column address latches (including latency configuration if applicable) • Block and wordline decoding • Bitline decoding • Redundancy scheme for row and column Voltage Generator System • VPP Pump and Regulator • VBB Pump and Regulator • Internal VDD Regulator • Internal Reference Voltage Generators Voltage Switches • Bitline Precharge Voltage Generator • Cell Plate Voltage Generator Command, Control and Test Circuitry • Input Buffers for all command and clock pins • Command decoding and control signal generation • Mode registers Refresh counters and control Power Up Circuitry Embedded Flash Memory • Test circuitry

Recent OMR Reports

DEF-1804-803  |   Published: 20 June 2018
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...
EXR-1804-803  |   Published: 8 June 2018
This report presents an Exploratory Analysis of the DRAM die, with the markings K4F2A164HF, found in the Samsung S5K2L3SX rear camera module extracted from a Samsung Galaxy S9+ (model SM-G965N) smartphone.
FAR-1804-803  |   Published: 7 June 2018
This report presents a Digital Functional Analysis of the MediaTek MT6771V Helio P60 chipset’s AM10788B die, found inside the OPPO PACM00 R15 smartphone. The MediaTek MT6771V Helio P60 chipset, manufactured...