Interested in this report?

Published: 23 December 2016

Product Type Phablet
Brand Huawei
Device Name Honor V8
Device Model # TKN-TL10
Official Release Date 07/15/2016
Target Market China & India
Retail Price $480.0
Weight (grams) 179.4 (Measured)
Device Dimensions (mm) 157.1 x 78.0 x 7.65 (Measured at Longest/Widest/Thickest Points)
Product Features
Operating System Android 6.0 "Marshmallow" + EMUI 4.1
Processor Spec Octa-Core HiSilicon Kirin 950 (2.3 GHz @ Cortex-A72 + 1.8 GHz @ Cortex-A53)
RAM Support 4 GB LPDDR4 SDRAM
Communications GSM / EDGE: 850/900/1800/1900 MHz,
W-CDMA / HSPA+: 850/900/1900/2100 MHz,
TD-SCDMA: 1900/2100 MHz,
LTE: 1800/2100/2600 MHz,
TD-LTE: 1900/2300/2500/2600 MHz
Connectivity WiFi 802.11a/b/g/n/ac (2.4 GHz & 5 GHz), WiFi Direct, WiFi Hotspot, Bluetooth 4.2 LE, microUSB 2.0, NFC, GPS/GLONASS/BeiDou
User Interface Multitouch Capacitive Touchscreen
Storage Internal: 32 GB MLC NAND Flash
External: microSD (max. 128 GB)
Sensors 6-Axis MEMS Accelerometer & Gyroscope, 3-Axis Electronic Compass, ToF Sensor w/ Gesture Detection w/ IR Emitter, Fingerprint Sensor
Battery Type 3.82 V, 3400/3500 mAh (min/typ), Li-Polymer
Battery Life (Hrs.) Use Time: 25; Standby Time: 437
Display 5.7" IPS TFT-LCD, 1920 x 1080 Pixels, 16,777,216 Colors
Front Camera 8 MP BSI CMOS, 1080p Video
Rear Camera Dual 12 MP BSI CMOS (one Color / one Monochrome), Autofocus, Dual LED Flash, 1080p Video

Product Teardown Report Description

Survey Plus Reports include:
* Device Observations
* Analysis Summary
* Major IC Manufacturer Distribution
* RF Block Diagrams
* Main Enclosure material information
* Identify primary ICs and RF Modules such as SAW filters and Duplexers
* ICs and RF Modules categorized by Component Functions
* Provide package and die-size parameters
* Selected die photos
* Information on major sub-assemblies such as cameras and display/touchscreen subsystems
* Price estimates for the ICs and RF Modules

Recent OMR Reports

Report  |  1016-43837-O-6CV-100  |   Published: 31 March 2017
This CircuitVision report provides a set of hierarchical schematics for the Intel 5750 RF Transceiver. The circuit blocks extracted and analyzed for the report include the Transmit Path, Dual-Channel Receive...
Report  |  1116-44368-O-6CV-100  |   Published: 30 March 2017
Qualcomm UA630 Envelope Tracker contains single QFE3100 IC device in addition to surface mount components. The main Envelope Tracker die consists of boost regulators, linear regulator, average power tracking,...
Report  |  0317-44608-O-6CV-100  |   Published: 13 March 2017
Skyworks SKY78100 Power Amplifier Module contains several separate devices (Power Amplifier, Power Amplifier Controller, RF Switches and Duplexers) in addition to surface mount components. Power Amplifier...