Published: 3 January 2017

 

Product Type Virtual Reality Headset
Brand Google
Device Name Daydream VR Headset
Device Model # GA9A00001-A03-Z37
Official Release Date 11/10/2016
Target Market US
Retail Price $79.99
Weight (grams) 218.5 (Measured)
Device Dimensions (mm) 167.51 x 92.35 x 99.88 (Measured at Longest/Widest/Thickest Points)
Product Features
Operating System Proprietary
Processor Spec Dialog Semiconductor Low-Power Bluetooth Smart SoC
Connectivity USB 3.1, Bluetooth
User Interface Volume Control, Touchpad, App Button,
Home Button
Sensors 3-Axis Electronic Compass
Battery Type 3.7 V, 218 mAh, Li-ion
Battery Life (Hrs.) Use Time: 12; Standby Time: 24

Product Teardown Report Description

A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."

Product Teardown Report Value

View us as a wide-angle lens on the personal electronics landscape. We don't replace your expertise and insight, but rather amplify your capabilities and knowledge. Quantitative and qualitative information resources let you answer business-critical questions:
* What enabling electronics technologies are being developed and how will they affect end-products?
* How are my competitors designing with new technologies?
* How does my company compare in competitive benchmarking?
* What technology opportunities are implied from trends in product implementation?
* How will the product features that users want affect our design and technology decisions?

Recent OMR Reports

Report  |  1016-43837-O-6CV-100  |   Published: 31 March 2017
This CircuitVision report provides a set of hierarchical schematics for the Intel 5750 RF Transceiver. The circuit blocks extracted and analyzed for the report include the Transmit Path, Dual-Channel Receive...
Report  |  1016-44043-O-5CV-100  |   Published: 27 January 2017
This CircuitVision report provides a set of hierarchical schematics for the Toshiba THGBX6T1T82LFXF 3D NAND Flash. The circuit blocks extracted and analyzed for the report include the memory access (Memory...
Report  |  0516-00000-O-3DL-100  |   Published: 30 December 2016
The DesignLook report provides an overview of a semiconductor device and features a die floorplan along with details of the process and package. The report includes photographs of the package, die and...