Interested in this report?

Published: 27 January 2014

The probing analysis on the Toshiba (Sandisk/Toshiba) TH58TEG7DDJTA20 19 nm MLC NAND Flash will be completed on one of the dual 64 Gbit dice stacked inside the package. The analysis will provide details of the programming algorithm and on the internal voltages required to program, read, and erase the memory cells at the four ranges between reference threshold voltages. The probing analysis tests the flash in an active probe arrangement and voltage traces of the signals are recorded during program, read, and erase operations. The monitored signals includes a selected Main Wordline (MWL); a selected Bitline (BL); a Sourceline (SL), a Pwell isolation; and Global String Select Line (GSSL) and Global Ground Select Line (GGSL). TechInsights will first need to extract portions of the data and address path to determine where to position the probe points. This report contains: 1. Waveforms of the Program/Verify operation on signals: MWL_sel, BL_sel, SL, PWELL, GSSL and GGSL. • Program all ”11” • Program all “01” • Program all “10” • Program all “00” 2. Waveforms of the Read operation on signals: MWL_sel, BL_sel, SL, PWELL, GSSL and GGSL. • Programmed states: “11”, “10”, “01” and “00” 3. Waveforms of the Erase operation on signals: MWL_sel, BL_sel, SL, PWELL, GSSL and GGSL. • Programmed Block • Erased state Block

Recent OMR Reports

EXR-1804-803  |   Published: 8 June 2018
This report presents an Exploratory Analysis of the DRAM die, with the markings K4F2A164HF, found in the Samsung S5K2L3SX rear camera module extracted from a Samsung Galaxy S9+ (model SM-G965N) smartphone.
FAR-1804-803  |   Published: 7 June 2018
This report presents a Digital Functional Analysis of the MediaTek MT6771V Helio P60 chipset’s AM10788B die, found inside the OPPO PACM00 R15 smartphone. The MediaTek MT6771V Helio P60 chipset, manufactured...
FAR-1803-802  |   Published: 6 June 2018
This report presents a Digital Functional Analysis of the Samsung S5E9810A02 die found inside Samsung Exynos 9810 PoP component. The Exynos 9810 component was extracted from a Samsung Galaxy S9+ smartphone...