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Published: 6 July 2018

The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

  • Package photographs and X-rays
  • Top metal die photographs
  • Optical cross section of general package structure
  • SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
  • Scanning electron microscopy (SEM) cross section of EMIB structure and die to EMIB interconnect
The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.

Report Description

This product presents an Advanced CMOS Essentials Package Analysis on the Intel SR3RM HBM2 package built with Intel’s embedded multi-die interconnect bridge (EMIB) technology. The Intel SR3RM is the 8th Generation Intel® Quad Core™ i5-8305G processor with Radeon™ RX Vega M GL graphics processing unit (GPU).

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