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Published: 25 April 2016

This report presents a Basic Functional Analysis of the STMicroelectronics S3L012BA die found inside the VL53L0B time-of-flight (ToF) sensor module. The VL53L0B is a plastic optical land grid array (LGA) package with a printed wiring board (PWB) substrate and 12 lands at the bottom. There are two dies in the package, the VCSEL die which serves as an infrared (IR) source, and the S3L012BA die which includes a single photon avalanche diode (SPAD) IR detector and a microcontroller.
This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
  • Product Teardown Report Description

    This report presents a Basic Functional Analysis of the STMicroelectronics S3L012BA die found inside the VL53L0B time-of-flight (ToF) sensor module. The VL53L0B is a plastic optical land grid array (LGA) package with a printed wiring board (PWB) substrate and 12 lands at the bottom.

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