Interested in this report?

Published: 25 April 2016

This report presents a Basic Functional Analysis of the STMicroelectronics S3L012BA die found inside the VL53L0B time-of-flight (ToF) sensor module. The VL53L0B is a plastic optical land grid array (LGA) package with a printed wiring board (PWB) substrate and 12 lands at the bottom. There are two dies in the package, the VCSEL die which serves as an infrared (IR) source, and the S3L012BA die which includes a single photon avalanche diode (SPAD) IR detector and a microcontroller.
This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
  • Report Description

    This report presents a Basic Functional Analysis of the STMicroelectronics S3L012BA die found inside the VL53L0B time-of-flight (ToF) sensor module. The VL53L0B is a plastic optical land grid array (LGA) package with a printed wiring board (PWB) substrate and 12 lands at the bottom.

    Recent OMR Reports

    FAR-1808-802  |   Published: 19 September 2018
    This report presents a Basic Functional Analysis of the Intel 82574 die found inside Intel WCS9200 package. The Intel WCS9200 package was extracted from the Rivet Networks Killer wireless-AC 1550 Wi-Fi...
    FAR-1808-901  |   Published: 19 September 2018
    This report presents a basic Functional Analysis of the Broadcom BCM4775 dual-frequency GNSS die found inside Broadcom BCM47755KUB1G package. This report contains the following detailed information:...
    ACE-1805-801  |   Published: 17 September 2018
    The Advanced CMOS Essentials (ACE) deliverable for 3D NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the in-depth...