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Published: 10 May 2018

This report presents a Basic Functional Analysis of the Silicon Labs EM358A3 die found inside the Silicon Labs EM3587 mesh networking SoC package. The Silicon Labs EM3587 mesh networking SoC packages were extracted from a Samsung SIP-KITNXB001 ARTIK 520 smart IoT module and a Nest NC3100EF Cam IQ Wi-Fi indoor camera.

This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

Report Description

This report presents a Basic Functional Analysis of the Silicon Labs EM358A3 die found inside the Silicon Labs EM3587 mesh networking system-on-chip (SoC) package. The Silicon Labs EM3587 mesh networking SoC packages were extracted from a Samsung SIP-KITNXB001 ARTIK 520 smart Internet of Things (IoT) module and a Nest NC3100EF Cam IQ Wi-Fi indoor camera.

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