• The DesignLook report provides an overview of a semiconductor device and features a die floorplan along with details of the process and package.

    The report includes photographs of the package, die and die marking; a package x-ray, optical and SEM based plan view images of selected blocks (i.e. I/O, memory, mixed-signal), and SEM cross sectional images of the package and key features of the die.

    An annotated diffusion level die photograph is provided to identify the major I/O, embedded memory, standard logic, and major repeating mixed-signal blocks.

    Conclusions presented within this report are based on optical, SEM plan view and cross-sectional images.

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