The iPhone 7 brings us the new A10 processor. This report is a process analysis report of the Apple A10, TSMC inFO-WLP Package Technology Process.
The A10 processor Package on Package module was the first observation of TSMCs Integrated Fan-Out (InFO) packaging technology.
TechInsights has launched an Advanced CMOS Essentials (ACE) packaging analysis report on this innovative packaging technology from TSMC and Apple.
Understand all aspects of advanced process technologies and where the competition will be with respect to Moore’s Law cost scaling. Leverage this understanding to improve your next-node technology choices.
Interested in Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging on this device? Lean about our capabilities here, and contact us.
First Look Inside The iPhone 7: Teardown Shows Intel Inside.
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