• Mobile Devices

  • Our mobile channel includes smartphones, tablets and phablets.

    Our device selection is based on point of sale (POS) data and covers a variety of geographical centres.
    Teardown reports also include an in-depth cost estimate of the bill of materials (BOM).


    Deep insights into design win information

    Details on how the product is built and how it works

    Innovative design features and even supply chain relationships.

    In-depth cost estimate of the bill of materials (BOM) included


    Available mobile devices teardown reports

    Our Teardown reports use a standard format to help you quickly navigate each device report and find the data that’s important to you. Three types of teardown reports provide increasing analysis and insights:

    • Projected number of teardowns: 190 reports annually

    Deep Dive Teardown Reports

    Our mobile channel includes smartphones, tablets and phablets. Our device selection is based on point of sale (POS) data and covers a variety of geographical centres.

    Our most exhaustive and popular type of teardown report, available across all channels

    A full product teardown that includes:

    • ICs identification and costing
    • A PDF report containing pictures of circuit boards with annotated ICs, major subassemblies, antennas
    • Die photos for major ICs and tables for features description and dimensional data
    • Costed bill of materials (BOM) spreadsheet
    • RF block diagram
    • System block diagram

    Deep Dive report coverage is not limited to electronics, it also includes a BOM for all non-electronic parts, each of which is also costed, so we can provide a total cost for the product.

     

    Survey Plus Teardown Reports

    Available only for our Mobile Device Channel, and includes:

    • A PDF report containing pictures of circuit boards with annotated ICs, major subassemblies, antennas
    • Die photos for major ICs and tables for features description and dimensional data
    • Costed bill of materials (BOM) spreadsheet
    • RF block diagram

    Survey Plus Reports are essentially a major electronics teardown where we catalog and identify ICs for all major functions.

    Quick Turn Teardown Reports

    Get a quick look before the final report is ready.

    Quick Turn reports are meant to help you quickly identify the major IC wins at a system level.

    • Costed bill of materials (BOM) spreadsheet


     

     

    Access the data you need faster than ever

    A TechInsights IC analysis subscription gives you the data you need – instantly. Our new TechInsights Application platform lets you:

    A subscription to TechInsights' Teardown platform gives you the data you need - instantly. Using a high-speed search engine, you have access to our latest teardown data. View or download images and reports; compare products and determine the relationships between components and devices through detailed genealogy charts. With TechInsights' Teardown subscription, you’ll always be on top of our latest teardown data through email notifications or your favorites settings.