• The Most Accurate Competitive
    Technical Intelligence

    Get the insight you need to see further, more quickly,
    and make better design decisions

  • TechInsights Reports

    Accurate, referenceable information is
    critical for making business decisions.
    TechInsights has been publishing
    technology analysis for over 30
    years
    , revealing the innovation others
    cannot and enabling our customers to
    advance their intellectual property
    and product strategies.

    With a historic archive of over 12,000
    reports, and hundreds of new
    reports published each year
    , the
    TechInsights has the world’s largest
    archive of reverse engineering
    analysis on semiconductor and
    consumer products.

    Reports are available for individual
    purchase
    , and they are classified by
    type of analysis, product type,
    component type, and manufacturer,
    making it easy to find the information
    you need.


    Intellectual Property Applications

    TechInsights reports enable fact-based IP decisions in support of licensing, defense, acquisition, divestiture, and prosecution projects. Our reports are used by legal personnel, program managers, and engineers to:

    • Conduct preliminary and deeper dive technical analysis
    • Find evidence of use to create court defensible claim charts
    • Drive fact-based campaign planning and decision making
    • Discover potential infringement in components or dies of competitors
    • Find targets that will give the highest potential return on licensing
    • Obtain accurate data for planning a potential defensive strategy or assertion case
    • Make better portfolio management decisions to invest, abandon, acquire or divest

    Competitive Intelligence Applications

    TechInsights reports provide the level of competitive analysis you require, from product- level teardown and bill-of-materials analysis to detailed, die-level structural, process and circuit information.

    Our team of subject matter experts track the consumer electronics market to find innovative & disruptive semiconductor events. Our reports are used by finance, procurement, product marketing, product managers, architects and designers to:

    • Gain an understanding of market direction and market opportunities
    • Gather information to reduce risk and shorten the design cycle of their next design
    • Benchmark against competitors and suppliers (technology, performance, features, costs)
    • Understand who is winning and where innovation is occurring


    Breadth and Depth of Technical Analysis

    TechInsights analyzes and reports on advanced technology products from the product-in-packaging level, to the atomic level.

    We offer several report types, which provide different depths of analysis depending on the type of event, with deep levels of analysis required to identify process and circuit innovation.

    The following table provides a list of example report types categorized by the depth of analysis required. The report types listed below are only a portion of the report types we have in our library.

    Level of Analysis
    Example Report Types Example Content
    System
    Custom Reports Project dependent
    Waveform Analysis (WAR): Internal and external PDF covering voltages and programming algorithms required to program, read and erase the memory/Storage device
    Product and Subsystem
    Deep Dive Teardown (DDT) Full teardown and bill-of-materials with IC identification, die photos, system block diagrams, and costed bill of materials
    Quick Survey Teardown (QST) BOM on major ICs only
    Survey Plus Teardown (SPT) Teardown and BOM on major ICs and RF block diagram + Costed Bill of Materials
    Process
    Device Essentials Folder (DEF) One-page summary of device metrics and salient features and image folders covering teardown, package x-ray, die photos, and exploratory SEM.
    Advanced CMOS Essentials (ACE) Analyst’s summary of critical device metrics, TEM-EDS and salient features with image folders covering Teardown, die, SEM and TEM imaging
    Structural Analysis Report (SAR) Descriptive commentary and analysis with detailed image annotations, data tables
    Process Review Report (PPR) Subset of a SAR (no teardown, x-ray, materials or floorplan analysis.
    Imager Process Review (IPR) Image sensor focused report with product, component and die analysis, with functional and process analysis and additional analysis on the pixel array
    Functional
    Basic Functional Analysis (BFAR) High-level teardown information (product, component, die), process, functional and cost analysis
    Digital Functions Analysis (DFAR) BFAR analysis + Digital block analysis
    Architecture Report (ARC) Architectural analysis of the RF blocks of the component. Package, die and RF block analysis. Delivered using CircuitVision tool
    Transistor Characterization (TCR) Analysis on the DC electrical properties of the logic NMOS and PMOS transistors
    Circuit Analysis (CAR) Architecture overview, detailed schematics and major findings. Delivered using CircuitVision tool to provide hierarchical navigation from functional blocks down to gate and transistor levels
    Standard Cell Essentials (SCE) Standard libraries to understand routing efficiency, cell utilization, standard cell layout, critical features





    CircuitVision™

    All circuit reports include a PDF report plus our powerful CircuitVision interface. This provides a highly interactive, easy to navigate view of circuit design including the physical implementation on the integrated circuit. Hierarchical schematics are recreated in a way that mirrors developers’ design from the block down to the gate level – all linked to the original layout, showing the extracted gates and associated interconnects.