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Taiwan Earthquake Billion-Dollar Data Center Fallout

Taiwan Earthquake: Billion-Dollar Data Center Fallout

A recent earthquake in Taiwan has disrupted industries, including the data center market, raising concerns about supply chain stability.
April 03, 2024 Apr 3
DRAM Scaling and Maximum Memory Capacity

DRAM Scaling and Maximum Memory Capacity

Discover the latest advancements from industry leaders Micron, Samsung, and SK hynix, and gain insights into the future of technology.
April 03, 2024 Apr 3
2023 Automotive Semiconductor Vendor Share

2023 Automotive Semiconductor Vendor Share: STMicroelectronics Closing in on NXP and Infineon

The automotive semiconductor landscape in 2023 showcased Infineon and NXP retaining their top positions, with Infineon widening its lead over NXP.
April 03, 2024 Apr 3
Huawei's Q4 2023 Resilience in China Market

Huawei's Q4 2023 Resilience in China Market

Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.
April 02, 2024 Apr 2
Micron Q1 2024

Micron Q1 2024 (FY Q2 2024) Report Summary

Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.
April 02, 2024 Apr 2
DRAM IC Sales Up 81% YoY the week ending March 22, 2024

DRAM IC Sales Up 81% YoY the week ending March 22, 2024

Semiconductor sales were down 2% last week but increased 19% from this time last year. Zooming in on DRAM IC, the 13-week MA jumped 81% YoY last week.
April 02, 2024 Apr 2
Renesas, TSMC Embed Fast MRAM

Renesas, TSMC Embed Fast MRAM

Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.
April 01, 2024 Apr 1
ST Introduces Its First 64-Bit SoCs

ST Introduces Its First 64-Bit SoCs

The STM32MP2 devices integrate up to two Cortex A35 CPUs with a substantial number of I/Os for embedded industrial applications.
April 01, 2024 Apr 1
AINotebookPC

AI Notebook PC Forecast: 95% AI-Capable Shipments by 2029

AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
March 27, 2024 Mar 27
Samsung Dominates Latin America's Smartphone Market Q4 2023 Breakdown

Samsung Dominates Latin America's Smartphone Market: Q4 2023 Breakdown

In Q4 2023, Latin America's smartphone market experienced significant growth driven by economic improvements, festive occasions, and the introduction of new Apple iPhone models.
March 27, 2024 Mar 27
NVIDIA Power Blog

NVIDIA's Blackwell Platform: Powering AI with Advanced Electronics

NVIDIA's unveiling of the Blackwell Platform at GTC 2024 has sparked industry-wide excitement, showcasing the company's prowess in AI computing.
March 26, 2024 Mar 26
Automotive Market Outlook Webinar Series

Automotive Market Outlook Webinar Series

Anticipate and adapt to automotive semiconductor landscape changes with market projections, emerging tech insights, and key demand drivers. Gain valuable foresight now.
March 26, 2024 Mar 26
ipad refresh

Apple iPad Model Tracker 4Q 2023: Big Changes Expected in 2024 Refresh

Apple is rumored to launch new iPad Pro models with the M3 chip and even new iPad Air models in late March 2024, kicking off a year of iPad updates. These will be important updates to Apple’s portfolio and should be cast in the new light of what is possible with on-device AI to reinforce the messaging that iPads are PC replacements as well as entertainment devices.
March 25, 2024 Mar 25
First PMIC Video Briefing of 2024 Now Available

Unlocking Insights: First PMIC Video Briefing of 2024 Released!

In this briefing we focus in depth on a highly integrated PMIC designed for multi-port charging applications from Infineon, the CYPD7271-68LQXQ. It incorporates an ARM® Cortex®-M0 32-bit MCU, 128 KB Flash, 32 KB ROM, 16KB SRAM and power devices all on a single die with the embedded flash observed to be a silicon-oxygen-nitrogen-oxygen-silicon (SONOS) design.
March 25, 2024 Mar 25
Highlights from the NVIDIA GTC Conference

Highlights from the NVIDIA GTC Conference

Discover the latest advancements and insights unveiled by NVIDIA in our blog, keeping you informed on cutting-edge technology and developments in the tech industry.
March 25, 2024 Mar 25
Unveiling the Logic Advanced Packaging Briefing

Unveiling the Logic Advanced Packaging Briefing

Three times a year we curate important updates, supplementary analysis of recent reports, high-level packaging process flows, and sneak peeks at upcoming devices and packaging reports. The result is an Advanced Packaging Analyst’s Briefing, and this year it has a new video format, the first of which is now available on-demand to our subscribers.
March 25, 2024 Mar 25

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