Featured Report Analysis
3D NAND – Recent QLC
A comparison of the recently analyzed 1YY-L quad-level cell (QLC) 3D NANDs (Samsung V7 QLC, KIOXIA/WD BiCS6 QLC, Micron Gen5 QLC and Solidigm Gen5 QLC) with YMTC Gen4 QLC 3D NAND is presented. In addition, projection of KIOXIA/WD QLC to achieve bit density of 100 Gb/mm2 for one thousand layers 3D NAND is made.
Nordic nRF52840 Multiprotocol BT 5.4 LE Sidewalk SoC Floorplan Analysis
The Nordic TMJD13 die was found inside the Nordic nRF52840 component. The nRF52840 component was extracted from the RAKwireless RAK4630 LoRa Bluetooth module. The nRF52840 component is positioned as a multiprotocol RF transceiver for wireless connectivity.
Apple iPad Pro 13" A2926 Deep Dive Teardown
Apple iPad Pro 13" is Apple's thinnest product ever at 5.1mm. It is available for both Wi-Fi/Cellular connectivity. It is designed with the new Apple M4 chip APL1206 Application Processor and Qualcomm SDX70M Baseband Processor, 13" XDR display 2752x2064 pixels, front and rear 12MP cameras.
Samsung Exynos W1000 Wearable Processor Samsung SF3 GAA Process – Release 1
This report provides a preliminary analysis of the structure and materials used in the manufacture of of the Samsung Exynos W1000 wearable processor die, fabricated using the SF3 process, Samsung’s second-generation (gate-all-around) GAA process.
HP Omen 16 (2023) (7N9X4UA_ABA) Deep Dive Teardown
HP Omen 16 2023 laptop is released specially for gaming applications, powered by AMD Rayzen 7840H processor and NVIDIA GeForce RTX 40 series graphics processor. Laptop designed with Wi-Fi 6e/Bluetooth 5.3 and 2TB PCIe Gen 4 Samsung SSD.
Canon 3.2 MP Stacked SPAD Image Sensor Device Essentials Plus
This report provides a detailed analysis into the structure of the Canon LBC010 SPAD die. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.
Galaxycore GC32E1 Device Essentials Plus
This report provides an extended insight into the structure of the Galaxycore GC32E1 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor, including a summary of the salient features observed, and accompanied by a set of optical, SEM cross-section, and bevel images of the CIS die.
Component Price Landscape Q2 2024
In 2024, semiconductor sales started experiencing robust growth. The total market for semiconductors grew by 24% in the first half (1H) of 2024 and is expected to continue surging in the second half (2H) at a rate of 29%.
July McClean Report
The July Update to the McClean Report reviews semiconductor industry capital spending and capacity. Semiconductor fabrication is an exceptionally capital-intensive process.
Insight: LG Buys Athom to Take on Samsung SmartThings and Tech Giants
TechInsights expects LG’s acquisition of Athom to deliver a win-win for both companies and will help LG to narrow the gap on its smart home ecosystem competitors, Samsung, Amazon, and Google.
Samsung Completes 51 Quarters of Leadership in The Latin America Smartphone Market in Q1 2024
As per the latest research from Wireless Smartphone Strategies-TechInsights, Latin America smartphone market volumes grew in strong double digits at 21% YoY in Q1 2024. This is the highest quarterly annual growth rate of the region since Q3 2021.
Does AWS’s new Graviton 4 really deliver on price-performance?
AWS previewed its new Graviton4-based EC2 r8g instances at re:Invent 2023. It is now generally available in four AWS regions. The r8g offer 30% better performance and will be available in large instance sizes with up to 3x more vCPUs (up to 48xl) and memory (up to 1.5TB) than Graviton3-based r7g instances.
Thailand xEV Market Demand Outlook 2022-2031
This report summarizes forecasts for the Thailand’s market for xEV systems, semiconductors, and sensors. Despite uncertainties such as the Ukraine conflict, semiconductor shortages, and a slowing global economy, the momentum towards electrification and battery electric vehicles remains robust, with volume demand continuing to rise.
Loongson 3A6000 CPU Digital Floorplan Analysis
This CPU contains a quad-core 2.5 GHz LSA664 CPU, four 16 MB L3 cache memory, and two DDR4x memory controller. Look further into this digital floorplan analysis (DFR) to find out the process node, BEOL stack, bit cell usage, and manufacturing cost.
Analysis: Smartphone Display Panel Market Share Q1 2024
The global smartphone display panel market experienced a dip in revenues of over 10% percent year-over-year in Q1 2024. The revenues fell on the back of declining panel ASPs and diminishing LCD market demand that impacted the performance of key display vendors in the period.
Handset Vendor Market Share for 60 Countries: Q1 2024
Global handset shipments grew by 7.5% annually in Q1 2024. The "Sixty" counties tracked in this report accounted for 88% of the handset volumes in the quarter. Samsung, Apple, and Xiaomi were the top three vendors by consolidated shipments to these markets.
Memory Pricing Report – July 2024
This monthly update delves into the dynamic and volatile pricing landscape of mainstream DRAM and NAND memory, offering an examination of pricing trends over the past three months and projecting developments for the upcoming year.
Smart Home Device Shipments to Exceed 2.5 Billion in 2030
This report is an overview of what is included within TechInsights: Smart Home Device Shipments to Exceed 2.5 Billion in 2023.
