How do you continue to innovate and produce increasingly more powerful and complex silicon wafers, while simultaneously addressing environmental concerns related to the energy and water needs, as well as the chemical and carbon emissions that are part of the manufacturing process?

In the Meteor Lake CPU die, Intel has pushed the capacitance density of on-die capacitors to new heights by taking a page out of DRAM’s book of tricks.

AMD pans to roll out next year new low-cost Spartan FPGAs that use 16 nm process technology and integrate hard IP and advanced security features.