Apple M4 SoC Digital Floorplan Analysis
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The TMRV93 die was found inside the Apple APL1206 M4 processor. The Apple M4 component was extracted from the Apple iPad Pro released on May 7, 2024. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately. This provides information and insights into the design and process attributes that may relate to performance. Additionally, foundry and process node identification, as well as cost analysis, are provided.
