Loongson 3A6000 CPU Advanced CMOS Process Analysis
Explore how the Loongson LS3A6000 CPU was made! This report dives into SMIC’s 12nm finFET process, featuring detailed SEM, TEM, and materials analysis of FEOL, MOL, and BEOL structures.
The Loongson LS3A6000 CPU die was likely fabricated using SMIC’s 12nm finFET high-k metal gate CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
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