Taking Monolithic Designs to Disaggregation

The term ‘chiplet’ has come into use to describe an evolved design strategy moving past monolithic system-on-chip (SoC) to the heterogeneous integration of a disaggregated design in a system-in-package (SiP). This next step beyond multi-chip modules (MCM) is a key aspect of differentiating chiplet designs; by definition, a chiplet is an individual die that cannot provide useful function by itself.

In a recently published update taking a deep dive into the Chiplet Market – Compute Segment, our experts provide an outlook on chiplet-enabled SiP unit shipments in the compute segment, which includes desktop PCs, notebook PCs, and more.

As part of our Advanced Packaging and Chiplets Spotlight Series, you’ll discover:

• The Evolution of Chiplets: Discover the evolution of chiplet designs and how they differentiate from traditional multi-chip modules (MCM).
• Market Insights: Gain insights from SEMICO's 2023 data on ASIC design starts across various market applications, projecting a rise from 55,000 in 2024 to 60,000 by 2027.
• Growth Projections: Learn about the chiplet market's rapid growth, expected to surge from 15% of the total chip market in 2023 to 33% by 2030, with a notable CAGR of 19.7%.
• Compute Segment Focus: Explore detailed forecasts on chiplet-enabled SiP unit shipments in the compute segment, including desktops, notebooks, tablets, servers, and data center SSDs, anticipating over 400 million units by 2030.
• Architectural Shifts: Understand the projected shifts in market share among Arm-, x86-, and RISC-V-based architectures.