
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Optical and scanning electron microscopy (SEM) cross-sectional micrographs of the package general structure, die assembly, PWB, and solder joint
- Measurements of vertical and horizontal dimensions of major package features
- SEM-based energy dispersive spectroscopy (SEM-EDS) analysis of the package material composition