This report presents a Basic Floorplan Analysis of the Decawave DW1000 UWB radio IC die found inside the Decawave DW1000 QFN package. The Decawave DW1000 QFN package was extracted from the Decawave DWM1001C UWB and Bluetooth module.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon level
• Identification of major functional blocks on gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process