Broadcom BCM56970 StrataXGSTomahawk II TSMC 16FFC FinFET Process Digital Functional Analysis

Product Code

FAR-1809-801

Release Date

14/11/2018

Availability

Published

Product Item Code

BRO-BCM56970A0KFSBG

Device Manufacturer

Broadcom

Device Type

Ethernet Switch

Subscription

Logic

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Broadcom BCM56970 StrataXGSTomahawk II TSMC 16FFC FinFET Process Digital Functional Analysis

This report presents a digital functional analysis on the Broadcom BCM56970 StrataXGS Tomahawk II TSMC 16FFC FinFET process.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI, gate, contacts, and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the CircuitVision software

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