This is an Advanced Packaging Essentials (APE) summary document for the Samsung 9820 application processor package-on-package (PoP) with interposer technology. The complete APE deliverable includes: concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:

• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical plan-view images of selected printed wiring board (PWB) metal layers
• SEM and optical cross section of the general package structure, metals, dielectric materials, and the die and package interconnect structure