This report presents a Digital Functional Analysis of the HG11-PL323-2 die, found inside the Qualcomm 5G SM7250 system-on-chip (SoC) application processor package. The Qualcomm SM7250 package was extracted from the Oppo Reno3 Pro 5G (model PCRM00).

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the CircuitVision software
• Cost of die based on the process analysis