The concise analysis summary report of critical device metrics, transmission electron microscopy-based energy dispersive X-ray spectroscopy (TEM-EDS) and TEM-based electron energy loss spectroscopy (TEM-EELS) results, and salient features, supported by the following image folders:
- Downstream product teardown
- Package photographs and X-rays, top metal and polysilicon die photographs
- Scanning electron microscopy (SEM) cross-section along the word line (WL) and the bit line (BL) of the 3D NAND array
- TEM cross-section along the BL
- TEM cross-section along the WL
- SEM/TEM bevel
- Memory array
- Memory array edge
- Periphery at the polysilicon level
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