SK hynix H5CG4XBX D1b DDR5 DRAM Memory Floorplan Analysis
Access executive summary with supporting optical, X-ray, SEM cross-sectional, and SEM bevel imaging sets.
Analysis of the floorplan design used in the Sk hynix H5CG4XBX Die (within H5CG48BHBD-X030 Package) 16 Gb 1b nm DDR5 and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die cost analysis are provided.