This report presents a Memory Floorplan Analysis of the Intel B17A 512 Gb die found inside Intel 29F02T2ANCTH1 package and Gloway Technology GW64T17I package. The 29F02T2ANCTH1 package was extracted from the Intel SSD DC P4511 series with the model number SSDPELKX020T8. The Gloway Technology GW64T17I package was extracted from the Gloway Technology SSD YCT240GS3-S7.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features in the bit line (BL) and word line (WL) directions
• SEM plan-view micrographs at the middle of the vertical channel level and the BL levels from the beveled sample
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software