Product Code
MFR-2001-801
Availability
Published
Product Item Code
SON-CXD5605
Device Manufacturer
Sony
Device Type
Communications IC
Sony CXD5605 eMRAM Memory Floorplan Analysis
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Plan-view SEM micrograph of the die delayered to the WL and BL layers
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in CircuitVision
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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