This report presents a package analysis (PKG) of the Sony IMX636 event-based vision image sensor. The Sony IMX636, co-developed with Prophesee, combines Sony's stacked image sensor technology with Prophesee's event-based vision sensing methodology. The stacked sensor has a resolution of 1280 x 720 and pixel pitch of 4.86 µm.
The PKG includes observed device metrics and salient features supported by the following unannotated image folders:

• Package photographs and X-ray images
• Die photographs
• Optical and SEM package cross-section photographs
• SEM-EDS spectra of selected package materials

The image set for a PKG project is derived from a package cross sectional analysis, supplemented by jet etch decapsulation, when applicable. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis. The PKG deliverable provides competitive benchmarking information and enables cost-effective tracking of multiple competitors' technology.