Qualcomm has the most design wins for the Hi-nova 9 PRO with nine of the major ICs. Qualcomm provided the SM7325-200-AB Applications/Baseband Processor, SDR735-001 RF Transceiver with GPS support and Power Managements PM7325-000, PM7325B-201-00, and PM7350C-002. For this device Samsung provided 8 GB of Mobile LPDDR4X SDRAM, 128 GB of 3D TLC V-NAND Flash, and Memory Controller (UFS 2.2) integrated in one chipset.