This report presents a Digital Floorplan Analysis of the AHH10816B die found inside the MT6885Z application processor, which is the bottom package of a package-on-package (PoP) module extracted from the OppoReno3 (PDCM00) 5G smartphone.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM plan-view micrographs showing the layout of the die at the levels, including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
• Cost of die based on the process analysis