Availability
Published
Product Code
DFR-2002-804
Product Item Code
TLA-UBQ01B0
Device Manufacturer
Tesla, Inc.
Device Type
Microprocessor
Subscription
Compute
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Tesla UBQ01B0FSD Processor Samsung 14 nm FinFET Process Digital Floorplan Analysis
This report presents a Digital Functional Analysis of the S4LR026A01 die, found inside the Tesla Full Self-Driving (FSD) UBQ01B0 system-on-chip (SoC) application processor package. It features the use of 14 nm finFET for the first time in a production vehicle. This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
- Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
- Plan-view optical micrograph of the die delayered to the metal gate level
- Identification of major functional blocks on a gate level die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and gate level die photographs delivered in the CircuitVision software
- Cost of die based on the process analysis
The Authoritative Information Platform to the Semiconductor Industry.
