Qualcomm SM8250 Snapdragon 865 Application Processor TSMC N7P FinFET Process Digital Floorplan Analysis

View Product

Availability

Published

Product Code

DFR-2002-805

Release Date

15/06/2020

Product Item Code

QUA-SM8250

Device Manufacturer

Qualcomm

Device Type

Applications Processor

Subscription

Compute

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Qualcomm SM8250 Snapdragon 865 Application Processor TSMC N7P FinFET Process Digital Floorplan Analysis

This is a Digital Floorplan Analysis of the Qualcomm SM8250 Snapdragon 865 application processor TSMC N7P FinFET process.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
Cost of die, based on the manufacturing cost analysis of the observed process

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