The Advanced CMOS Essentials (ACE) deliverable comprises a concise analyst summary of critical device metrics, TEM-EDS, TEM-EELS results, and salient features supported by the following image folders:
- Downstream product teardown
- Package Photographs and X-rays, top metal and polysilicon die photographs
- SEM bevel
- SEM cross section of the general device structure, metals, dielectrics, and detail of the FEOL structures
- TEM Bevel
- TEM cross section
The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.