![](/sites/default/files/styles/product_featured/public/ACE-2109-801.jpg?h=9675f0d7&itok=Y20F0o1K)
- Downstream product teardown
- Package photographs and X-rays, top metal and poly die photographs
- SEM bevel
- SRAM
- Logic
- SEM cross section of the general device structure, metals, dielectrics, and detail of the front end of line (FEOL) structures
- TEM bevel (including some high-angle annular dark-field scanning TEM (HAADF STEM) images)
- SRAM
- Logic
- TEM cross section
- Orthogonal to transistor fins
- Orthogonal to transistor gates
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