This report presents an advanced packaging essentials (APE) analysis of the Apple M1 MAX applications processor system-in-package technology. The M1 MAX is an applications processor used in Apple laptops and downstream products. Similar to the rest of the M1 series, the MAX processor is a system-on-chip (SoC). The processor itself is integrated into a system-in-package (SiP) structure with multiple DRAM memory packages. It is the SiP device that is analyzed in this report. The analysis was performed on the entire SiP structure, including DRAM memory packages.
This complete APE deliverable includes:

• Detailed analyst's summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features
• Downstream product teardown images
• Package photographs and X-rays
• Die photographs
• Optical planar view images of selected PWB metal layers
• SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure.