This report presents a Basic Floorplan Analysis of the Sony S4LP173 die found inside the Sony CXD5605 component. The CXD5605 package was extracted from the Huawei Watch GT 2 smartwatch. This is Sony’s newer generation GNSS receiver IC after the CXD5603. In Samsung's 28 nm FD-SOI with eMRAM, which is the world’s first commercial product TechInsights has observed.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process