Product Item Code
IoT - Basic Functional Analysis
This report presents a Basic Floorplan Analysis of the Broadcom BCM20739 Bluetooth 5.0 SoC die found inside the Cypress Semiconductor CYW20719 component.
Stay up to date on technology intelligence in the Internet of Things
TechInsights’ IoT subscription is the ideal solution for leaders who want to base their product roadmaps on hard facts and understand what’s really going on under the hood of cutting edge IoT devices and systems on chips (SoCs).