Product Code
DFR-2202-801
Availability
Published
Product Item Code
BRO-BCM56990
Device Manufacturer
Broadcom
Device Type
Microprocessor
Broadcom BCM56990 StrataXGS Tomahawk 4 TSMC 7 nm FinFET Process Digital Floorplan Analysis
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at different levels, including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
- Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
- Plan-view optical micrograph of the die delayered to the metal gate level
- Identification of major functional blocks on a gate level die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and gate level die photographs delivered in the CircuitVision software
- Cost of die based on the manufacturing cost analysis of the observed process
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
