The Sony 18.5 Mp 1.25 µm pixel pitch Exmor RTM back illuminated (BSI) CMOS Image Sensor was extracted from the Sony Cyber-shot DSC-WX100 digital Camera. The DSC-WX100, a compact and light camera featuring an ultra slim body design features a 10x optical zoom during movie recording, 20x digital zoom, BIONZ image processor, autofocus in 0.13 seconds, optical image stabilization capability, and maximum ISO sensitivity capability of 3200 is (expandable to 12800 using Sony’s “clear image zoom” technology, which uses a form of interpolation called “by-pixel super resolution”). This Imager Process Review takes the reader inside the process technology used to fabricate the device. The main feature of this BSI device is the use of a recessed vertical channel used in combination with a planar channel for a pixel array transfer transistor, which is the first implementation Chipworks has observed in an image sensor.