This report is an Imager Process Review of the Sony IMX260 12 megapixel (MP) stacked back illuminated (BI) CMOS image sensor (CIS) extracted from a Samsung Galaxy S7 edge smartphone. The IMX260 is Sony's third generation of the Exmor RS™ series stacked BI CIS, featuring, for the first time, direct bonding interconnect (DBI) hybrid bonding of the CIS die face-to-face to the ISP die, instead of through silicon vias (TSVs) used on previous Exmor RS generations. This device also features full chip phase detection autofocus (PDAF) achieved through dual photodiodes per pixel, and back deep trench isolation (B-DTI) pixel isolation for improved crosstalk suppression.