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This report provides a detailed package analysis of the SK-Hynix high bandwidth memory (HBM) including the DRAM die stacking and base logic die. The high bandwidth module used in the AMD Radeon™ R9 Fury X graphics card. The graphics card employs 2.5D system in packaging to integrate four HBM muldes and an AMD GPU onto a silicon interposer that is bumped to a an underlying package substrate. The HBM incorporates 3D packaging with four DRAM dies stacked on top of a base logic die. Copper through silicon vias (TSV) and Cu pillar-based fine pitch microbumping technology are used to join the stacked dies. The reported results are derived from scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (TEM-EDS), and electron energy loss spectroscopy (TEM-EELS) analyses.