This report contains the following detailed information:
- Summary of observed device metrics and salient features
- Package optical photographs, package X-ray images, die photographs, optical photos of the die feature image set
- Plan-view images of the device delayered to the gate level
- Exploratory cross-sectional scanning electron microscope (SEM) images of the device structure
- Detailed cross-sectional scanning capacitance microscopy (SCM) and scanning microwave impedance microscopy (sMIM-C) analysis of the dopant structures
- Detailed cross-sectional transmission electron microscope (TEM and STEM) images of the power device structure
- Metal and dielectric layer composition identification based on TEM-EDS results
The image set for a standard PEF project is derived from a beveled sample for SEM planar analysis, one plane of cross-sectioning for SEM structural analysis, a single TEM sample for the detailed structural analysis, and planar and cross-sectional SCM and sMIM analysis. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis.
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