This report is a Package Analysis of the Qualcomm MSM8974 Snapdragon 800 series application processor, which contains a quad-core Krait 400 CPU with up to 2.3 GHz per core and customized for low power consumption. It also is the first system-on-chip (SoC) to integrate a 4G LTE advanced modem with carrier aggregation and category 4 data speeds of up to 150 Mbps. The MSM8974 device was extracted from the Qualcomm 65-N9050-29 evaluation kit. The package on package (PoP) consists of a Samsung K3QF2F200B-XGCE DRAM package on top of the Qualcomm MSM8974 package. The Qualcomm MSM8974 is assembled in a 15 mm x 15 mm x 0.8 mm thick PoP flip-chip ball grid array (FCBGA) package, with 1,006 solder balls on the bottom of the package and 216 solder balls on the top of the package, distributed in two rows alongside the four edges of the package for electrically connecting to the DRAM.