The Samsung S5KHMXSP CMOS image sensor die is stacked on an image signal processor die. The CIS/ISP stacked die is attached to a metal plate through the PWB window, and the die is wire bonded to the PWB. The Samsung HMX is Samsung first 108 MP class mobile camera used in the Xiaomi Mi CC9 Pro rear camera.
The complete Package Analysis (PKG) deliverable includes summary document, listing observed critical dimensions and salient features. The summary is supported by the following unannotated image folders:

• Downstream product teardown overview
• Camera module or package photographs
• Camera module or package cross section
• SEM-EDS spectra of select features

Die photograph and non-invasive optical photographs of die feature image set