Qualcomm SDM845 Application Processor Samsung 10LPP FinFET Process Digital Functional Analysis

Product Code
FAR-1803-801
Release Date
30/05/2018
Availability
Published
Product Item Code
QUA-SDM845
Device Manufacturer
Qualcomm
Device Type
Applications Processor
Subscription
Logic
Channel
Logic - Digital FAR
This report presents a Digital Functional Analysis of the Qualcomm HG11-P7872-2 die found inside the Qualcomm SDM845 package-on-package (PoP) component. The SDM845 was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965U.
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