Samsung K4AAG045WD-4CRB 4 Gb DDR4 SDRAM Package Analysis Report

Product Code
PKG-1505-801
Release Date
13/07/2015
Availability
Published
Product Item Code
SAM-K4AAG045WD-4CRB
Device Manufacturer
Samsung
Device Type
DDR4 SDRAM
This report presents a Package Analysis of the Samsung K4AAG045WD-4CRB 4 Gb DDR4 SRAM. The K4AAG045WD-4CRB flip-chip fine pitch ball grid array (FBGA) package is 11.0 mm x 7.5 mm and is 0.76 mm thick, excluding the solder balls. The K4AAG045WD-4CRB component comprises a stack of four K4A4G085WD 1 Gb DDR4 SRAM dies flip- chip mounted to the printed wiring board (PWB). The three bottom memory dies of the stack have TSVs.
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.