Interested in this report?

Published: 29 September 2017

The Advanced CMOS Essentials (ACE) deliverable for NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and NAND flash
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • One or Two TEM cross sections, orthogonal to the word and/or bit lines, showing the NAND flash array cells, the lower metals and dielectrics, transistor gates, isolation, and other FEOL features
  • TEM bevel through the NAND flash
The results of TEM-EDS analyses are included in the ACE summary document. The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.

Report Description

This product presents Part 1 of an Advanced CMOS Essentials of the SanDisk/Toshiba 64-Layer 256Gb 3D NAND flash.

Recent OMR Reports

EXR-1810-801  |   Published: 3 October 2025
EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
CAR-1804-801  |   Published: 14 November 2018
This report presents a Partial CircuitVision Analysis of the SanDisk/Toshiba THGBX6T1T82LFXF 1016-44043-O-5CV-100 report and contains Sections 1, 2, 3, 5, and 7 (Introduction, Overview, Memory Array and...
CAR-1804-902  |   Published: 14 November 2018
This report presents a CircuitVision Analysis on selected analog blocks of the Analog Devices AD7793BRUZ analog-to-digital converter (ADC). This device is a 16-/24-bit S-? ADC with on-chip in-amp and reference....